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India Just Broke Ground on Its First 3D Glass Chip Packaging Facility. Here's Why the Back End of Semiconductors Is the New Front Line.
On April 19, 2026, the foundation stone for India's first advanced 3D glass semiconductor packaging unit was laid at Info Valley, Bhubaneswar — the first facility of its kind on the subcontinent, and only the second outside of the United States and Japan operating at this technology level. ₹1,943 Cr ₹799 Cr 50 Mn Aug 2028 Total project outlay SM fiscal support — central govt. Assembled units capacity per year Commercial production target What was laid at Info Valley on April
Thoughts Initiative Team
Apr 193 min read
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